IoT Devices
Connected sensors, gateways, and edge nodes with wireless provisioning and enclosure integration.
Manufacturing · Box Build Assembly
SDI box build programs turn populated PCBs, harnesses, and sub-assemblies into finished, ship-ready products — enclosure integration, functional testing, and packaging under one coordinated program.
Our Silicon Valley team manages mechanical fit, electrical interconnect, firmware provisioning, and factory QA so your complete product ships consistently — not just the board inside the box.

Where schematic-level electronics become a product customers can hold, use, and deploy.
Box build is the convergence point — PCB, enclosure, battery, sensors, display, and firmware must align in physical space with tolerances, thermal paths, and service access validated before the line runs.
SDI coordinates mechanical, electrical, and firmware teams during integration so assembly issues are resolved in engineering — not discovered on the factory floor.

End-to-end assembly services from sub-assembly through ship-ready packaging.
Full mechanical and electrical integration of PCB, enclosure, and peripheral subsystems.
Gasket seating, screw torque specs, display bonding, and ingress protection validation.
Custom harness routing, connector mating, and strain relief inside the product envelope.
Power-on, communication, sensor calibration, and user-flow validation on every unit.
Regulatory labels, serial numbers, MAC addresses, and traceability records.
Retail or bulk packaging, insert materials, and fulfillment-ready ship configuration.
Product categories where SDI box build programs deliver complete, commercial-ready assemblies.
Connected sensors, gateways, and edge nodes with wireless provisioning and enclosure integration.
Mobile platforms, arms, and autonomous systems with motor, sensor, and power sub-assembly integration.
Compact, polished products with display, battery, and user-interface assembly.
Patient-safe assemblies with isolation, labeling, and compliance-aware integration protocols.
Harsh-environment products with robust enclosure, harness, and functional test coverage.
Edge inference platforms with thermal management, sensor arrays, and compute module integration.
The production pipeline from sub-assemblies through ship-ready finished goods.
Enclosure prep, insert placement, and structural sub-assembly before electronics integration.
Board installation, connector mating, and harness routing with torque and fit verification.
In-line flashing, calibration, and unique identifier assignment per unit.
Power-on, communication, sensor, and user-flow validation against golden unit reference.
Cosmetic, mechanical, and electrical QC before release from the assembly line.
Packaging, labeling, and fulfillment configuration for commercial distribution.
Mechanical, electrical, and firmware teams integrated — not siloed during box build.
California engineers drive integration reviews, test strategy, and release gates.

Vetted box build partners with domestic pilot and Asia volume capacity.

Documented procedures, golden units, and traceability for every build.
Engineering infrastructure supporting every box build program.
Enclosure concepts and service access aligned to assembly sequence.
Tolerance stacks, tooling, and DFM for repeatable mechanical fit.
PCB releases, harness specs, and production firmware packages.
Ramp planning, yield tracking, and volume transition support.
Share your assembly requirements, BOM, or prototype status. Our box build team will scope integration, testing, and packaging as one complete program.
Request Free EstimateCommon questions about box build assembly, integration, testing, packaging, and production timelines.
Complete product integration — PCB, enclosure, harness, battery, and peripherals assembled into a finished, tested, ship-ready unit.
PCB assembly populates boards; box build integrates those boards into complete products with mechanical, electrical, and functional validation.
Yes. In-line flashing, calibration, and serial/MAC assignment are coordinated with embedded engineering.
IoT, robotics, consumer electronics, medical, industrial, and AI hardware platforms among others.
Power-on, communication, sensor calibration, and user-flow tests aligned to your golden unit reference.
Yes. Regulatory labels, serialization, retail packaging, and fulfillment-ready ship configuration.
Yes. Box build programs integrate mechanical DFM, torque specs, and fit validation from engineering.
Pilot builds typically run 3–6 weeks; production programs depend on complexity and volume targets.
Yes. EVT/DVT box builds are coordinated before full production ramp.
Submit your BOM, assembly drawings, and volume targets through our contact form.